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Thermax® PI/PAI – Rectangular
Thermax® PI/PAI is a high heat resistant enamel rectangular wire and highly reliable. This has a high space factor contributing to higher motor efficiency. Thermax® PI/PAI is used in high voltage driving motors for xEV. It is composed of rectangular copper with an enameled layer. In addition to the current lineup of a maximum of 60μm we are currently developing the enamel layer to provide a film thickness of approximately 100μm in view of high voltage.
Features:
- Rectangular shape enables a high space factor and contributes to higher motor efficiency.
- By selecting PAI or PI resin with high heat resistance, the enamel layer is highly reliable with a Thermal Index 220°C (PAI), 240°C (PI)
Build:
- Type 0
- Type 1
| Temp | Array | ||
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| Material |
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| Insulation | Polyamide-imide, Polyimide | ||
| Shapes |
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| Sizes | |||
| Standards |
NEMA: MW-84C, MW-20C |
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| Locations |
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| Markets |
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| Temp |
|
||
|---|---|---|---|
| Material |
|
||
| Insulation | Polyamide-imide, Polyimide | ||
| Shapes |
|
||
| Sizes | |||
| Standards |
NEMA: MW-84C, MW-20C |
||
| Locations |
|
||
| Markets |
|
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